Week #23 - June 27th to July 4rd - Temperature testing, CAD redesign and print, project report.

This week we could not meet with Dr. Ejaz due to some complication with schedules. This week I traveled to British Columbia, Canada for a work training. This limited my ability to work on some aspects this week. Just before leaving, I finished temperature testing the Raspberry Pi. Although I had noticed a change in temperature after adding a heatsink and fan, actual measurements needed to be taken for the report.

CAD case was redesigned and sent to the printer at Valencia college to do which I was in Canada. The idea is to have this final print ready by when I return.

During this week, I tabulated my results from temperature testing to prepare for the report as well as write ahead some sections that would be introduced in the report.